Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry.

In this chapter, the preparation of semiconductor-grade silicon from sand, its conversion into crystals ... 300-mm wafers will be the standard diameter until about 2007, and 400- or 450-mm diameter ...

And with the proposed acquisition of SunEdison Semiconductor, GlobalWafers would not only expand its efforts in 300mm, but it would gain an entry into the silicon-on-insulator (SOI) wafer business.

Infineon Technologies AG has progressed in its development of what it claims is the first 300 mm gallium nitride (GaN) power ...

A 300mm semiconductor wafer, which is the maximum wafer size in use as of 2024. Although 18-inch (450mm) wafers have been developed, the billions in cost to change all the chip-making machinery in ...

At the GlobalFoundries Technology Summit 2024, the theme was “AI Everywhere” as AI has impacted everything from IoT to the ...

Scientists from the Korea Institute of Energy Research (KIER) and Chungbuk National University (CBNU) have developed a new manufacturing process for ultra-thin silicon wafers. They claim their new ...

The company has succeeded in manufacturing 300 mm GaN wafers on an integrated pilot line in existing 300 mm silicon ...

The US Commerce Department said on Wednesday it planned to award Taiwan's GlobalWafers up to $400 million in government grants to significantly increase production of silicon wafers. The funds for ...

announced today the launch of its 200 mm silicon carbide epitaxial wafers (SiC epi-wafers). Substrate and epi-wafer shipments from the company at 350 micron and 500 micron thickness are now underway.