Capstone CS200 CMP systems from Axus Technology enable customers to realize per-wafer CoO savings of more than 50% for CMP processes on 200mm SiC wafers, compared to the closest competitor. · ...
Axus Technology is receiving orders from the world's top SiC makers for its Capstone CS200 platform CMP tools, including the Capstone CS200-ia model shown here. · GlobeNewswire Inc. CHANDLER, Ariz., ...
Plessey has announced a partnership with Axus Technology (Axus), a provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring ...
AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.
(MENAFN- GlobeNewsWire - Nasdaq) Customer Data Confirm Axus Capstone® Platform Delivers 2x Higher Throughput and More than 50% Lower Total Cost per Wafer Compared to Leading CMP Competitor CHANDLER, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results