Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...

TAIPEI, Taiwan — Advanced Semiconductor Engineering Inc., a supplier of packaging and testing services, has said that it has electroplated wafer bumping technology on 200-mm wafers and has begun a ...

A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...