Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

The trend in semiconductors leads to more IC test data volume, longer test times, and higher test costs. Embedded deterministic test (EDT) has continued to deliver more compression, which has been ...