Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

CarSim might be used to simulate the vehicle, road network and possibly other vehicles, and linked with other simulation tools that handle the advanced control algorithms. According to Sayers, “For ...

The capabilities of simulation software have developed rapidly over the past few years and underpin some of the more exciting possibilities in automation, including the industrial metaverse. But there ...

Consider the inside of a typical wind turbine nacelle. It will contain a gearbox, electrical controls, a generator, hub mounting, blade controls, and several other major systems. In the case of ...

Professional electronics designers must prevent wasted time (and added cost) due to numerous prototype/rework cycles caused by design oversights, variations caused by component tolerances, and/or ...