A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

Commercially available, Hysol QMI529LS die-attach material and Hysol GR828A mold compound are lead-free compatible and designed for thin and ultra-thin surface-mount device applications. Hysol ...

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System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Compression molding involves forming of complex shaped components by molding of a charge of fiber reinforced prepreg bulk molding compound (BMC) under heat and high pressures. Unidirectional fiber ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

Compression molding is a high-volume thermoset molding process that employs expensive but very durable metal dies. It is an appropriate choice when production quantities exceed 10,000 parts. As many ...