The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects Hsinchu, Taiwan -- July. 27, 2009 --Global Unichip Corp. (GUC; TW: ...
The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...
Parts 1 and 2 of this three-part series reviewed the basics and SiP package technology and detailed the design challenges specific to RF SiPs. In this final installment, the author outlines the steps ...
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