The Chosun Ilbo on MSN
LG Innotek’s smart IC substrate halves carbon emissions, boosts durability
LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
THIRUVANANTHAPURAM: As part of initiatives to achieve self reliance in the semiconductor sector, two application-specific integrated circuit (IC) chips designed ...
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