Intel’s main differentiator is unparalleled integration using hybrid laser-on-wafer technology and direct integration, which yield higher reliability and lower costs.

AUSTIN, Texas Intel Corp. has fabricated its initial ICs with 130-nanometer (0.13-micron) design rules on 300-mm wafers at its D1C development fab, the company said this week. Intel claims to be the ...

A technical paper titled “Probing single electrons across 300-mm spin qubit wafers” was published by researchers at Intel Corporation. Abstract: “Building a fault-tolerant quantum computer will ...