ByteSnap Design has introduced a new assessment tool aimed at helping manufacturers meet EN 18031‑1 cybersecurity requirements under the EU Radio Equipment Directive (RED) and prepare for forthcoming ...

ADLINK Technology has introduced its latest family of embedded graphics and AI accelerator modules built on NVIDIA’s new ...

Anglia Components is urging customers to prepare for tightening supply conditions in the electronic components market.

MIPS, now part of GlobalFoundries, has announced a collaboration with Inova Semiconductors to develop a robotics control ...

TrustInSoft has announced a significant update to its software verification platform, TrustInSoft Analyzer (TISA).

MediaTek has announced several additions to its Genio platform portfolio, introducing new solutions aimed at accelerating edge AI adoption across robotics, drones, smart home devices and industrial ...

The University of Cambridge has announced a major strategic partnership with quantum technology company IonQ that will bring the UK’s most powerful quantum computer to the institution. Partnership ...

Dukosi unveils a new proof‑of‑concept battery management solution developed in collaboration with STMicroelectronics.

Qt Group has announced a new collaboration with Qualcomm Technologies aimed at streamlining the creation of next‑generation ...

Renesas Electronics has announced the general availability of Renesas 365, a cloud‑based, model‑driven design environment developed in partnership with Altium. Renesas 365 design platform Credit: ...

Kontron has announced the release of the HARAKAN‑F2‑2, the latest addition to its rugged defence mission computer portfolio.

The i.MX 93W is the first applications processor to combine a dedicated neural processing unit (NPU) with secure tri‑radio ...