The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.

How can components be designed for an optimal balance of minimal weight and maximum robustness? This is a challenge faced by many industries, from medical device manufacturing to the automotive and ...

As communities face increasingly severe climate-related disasters, a shift to performance-based building codes is one of the ...

Volvo CE designs smarter with model-based systems engineering (MBSE). By connecting requirements, models and field data into ...

Learn how ESA can be used to assess transformer health, detect faults, and improve power quality across various applications, ...