Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
SAXONBURG, Pa., Sept. 25, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a breakthrough in short-reach optical interconnect technology with the ...
Abstract: Nonlinear characteristics of solar cells and changes in environmental conditions, such as temperature, and in particular, the intensity of daytime irradiation, make it difficult to identify ...
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