Semiconductor Engineering

Metrology Digs Deep To Produce Next-Generation 3D NAND

Deep vertical holes and re-entrant features challenge the best metrology methods.

Hewlett Packard Enterprise Company (HPE) Presents at Barclays 23rd Annual Global Technology Conference Transcript

Barclays 23rd Annual Global Technology Conference December 10, 2025 12:50 PM ESTCompany ParticipantsMarie Myers ...

Nintendo's Shares Take A Tumble Amid Renewed Chip Shortage Worries

It's not just RAM either. The console's NAND storage has also seen an estimated 8% price rise, as both SanDisk and Samsung ...

MKS Inc. (MKSI) Presents at 53rd Annual Nasdaq Investor Conference Transcript

MKS Inc. (MKSI) 53rd Annual Nasdaq Investor Conference December 9, 2025 6:00 AM ESTCompany ParticipantsJohn Lee - President, CEO & ...
Semiconductor Engineering

Smaller Geometries, Bigger Demands: The Role Of OCD In GAA Logic And Vertical Gate DRAM Process Control

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, ...

Shape-shifting cell channel reveals new target for precision drugs

From small ions to large molecules, cellular gates control what can pass in and out of cells. But how one such gate, called ...
Hackaday

Taking Electronics To A Different Level

One part wants 3.3V logic. Another wants 5V. What do you do? Over on the [Playduino] YouTube channel, there’s a recent video running us through a not-so-recent concern: various approaches to ...