CMU, Stanford, Penn, MIT, and SkyWater Technology achieved a milestone with the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed ...
At its stand at FAVS 2025, Leonardo showed videos of MIPS sensor testing against dummy RPGs (pictured) and UAVs. (Leonardo) Dstl detailed testing of the Modular Integration Protection System (MIPS) at ...
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