TSMC Q2 2026 earnings reached a record $40.2 billion in revenue, up 36% year over year, as the company raised its full-year ...

The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work ‌using ...

When Sam Bendavid, BEng 02, took over as chief executive officer of TC Transcontinental this past April, he was stepping into ...

Semicon 2.0 and the new mobile phone manufacturing scheme aim to attract Rs 4 lakh crore in investment and deepen India's ...

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial ...

AINewsWire Editorial Coverage: When people talk about the AI buildout, they tend to reach for the same shorthand: chips. But the more instructive story is unfolding one level down, in the precision ...

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

Explore human-centric packaging design from concept to launch with Sumit Kumar, R&D Innovation Manager. Learn how to balance ...

Odyssey Investment Partners, LLC ("Odyssey") today announced that it has made a majority investment in TransPak Inc. (“TransPak” or the “Company”), a global leader in packaging engineering, logistics, ...

AINewsWire Editorial Coverage: The AI buildout is usually described in one word: chips. But the more revealing story may be happening downstream in the specialty automation, robotics and semiconductor ...

AI should not be positioned as reducing the need for the semiconductor engineers. It should be now positioned as improving ...