An Extraordinary Milestone We’re celebrating our 1 trillionth archived web page. If you find our library useful, learn how you can help us fundraise! An Extraordinary Milestone We’re celebrating our 1 ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: In this study, we present a novel relaxed-intensified exploration algorithm (RIEA) to synthesize large-aperture sensor arrays producing good array sparsity and optimal weight vector of the ...
Some accepted solutions fail on certain edge cases because they don’t properly handle arrays where all elements are the same or where negative numbers are included. These cases are not covered in the ...
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